Application scope
Solder joint and mounted device inspection
Features
1.High speed, single FOV processing time is about 350ms
2.Anti-interference, high precision, large range
3.RGB light source seamlessly integrates 2D information to enhance judgment accuracy
4.Three-dimensional height visualization, which can display three-dimensional RGB data and height heat maps
Our AOI technology
Can save manpower, reduce losses and reduce costs
Improve product quality and enhance competitiveness
Increase corporate profits
【Core advantages and technologies】
High resolution image processing system
1.Ultra-high frame rate 5MP and 12MP high-speed color industrial cameras, combined with high-end large-diameter telecentric lenses, have low distortion, no squint, large depth of field, and are compatible with high and low component image clarity.
2.High-resolution imaging can be configured with different resolutions such as 8um, 10um, 15um, etc. to make subtle defects invisible.
3.Accurate calibration technology has the functions of field of view flat field correction, lens distortion correction, and installation error correction to achieve high-precision dimensional measurement.
4.Multi-angle light source highlights solder joints, silk screen and other features; equipped with a constant current controller to ensure the brightness consistency of the light source.
Technical parameter
| Device model |
K3412 |
| Detection capacity |
Detection items |
Miss print, over solder, insufficient solder, solder bridging, solder paste tailing, shape anomany, offset |
| Scanning method |
Stop&Go |
| Optical system |
Camera |
12MP high-speed color industrial camera |
| Light Source |
4 DLP light source (raster phase shift technology) and red, green and blue (RGB) light source |
| Resolution |
10μm & 15um (optional) |
| Detection performance |
Height accuracy (calibration module) |
1μm (using standard calibration block) |
| Volume repeatability |
<1% (standard verification block, 3Sigma) |
| Maximum Plate Bending Compensation Value |
±3mm |
| Detection Capability GRR |
<10%at6o(+50%tolerance, 5μm resolution) |
| Maximum detection height |
20mm/40mm |
| Solution to shadow problem |
Grating phase shifting technology to eliminate shadows & four-directional 3D light source illumination system |
| Plate bending real-time compensation method |
Plate Bend Compensation (Z-Tracking+Pad Referencing) |
| Test screen |
Color (3D and 2D images displayed together) |
| Driving equipment |
Servomotor+Screw Guide |
| Moving speed |
800mm/s |
| Minimum measurable product size |
50mmx50mm |
| Maximum product measurable size |
400mmx500mm |
| PCB thickness |
0.5~6mm |
| Track width adjustment |
Automatic width adjustment, manual width adjustment |
| Circuit board conveying/fixing |
Belt conveyor/pneumatic clamp fixing |
| Conveying direction |
From left to right, right to left |
| Orbital height |
900±20mm |
| Computer Configuration |
Mainframe |
CPU: Intel i5, RAM: DDR4-16G, GPU: GTX1660-6GB, SSD:250G, HDD: 2T |
| Monitor |
22"LED |
| Operating system |
Ubuntu |
| Parameters |
Overall size |
W1000xD1380xH1600mm (excluding alarm light) |
| Weight |
1100KG |
| Power source |
AC220V/50~60Hz/2000W |
| Air Pressure |
0.5Mpa |
| Software Supported Input Formats |
Support Gerber format (274X), ODB++ |
| Environmental requirements |
Temperature: 5~40℃, relative humidity: 25%~80% (no frost) |
| Upstream and downstream equipment communication |
Standard SMEMA interface |
【Open AI deep learning tools】
It can be trained and tested according to customer requirements, and the big data model automatically determines NG/OK without repeated manual debugging, easily improving the pass-through rate.
A variety of deep learning algorithms to effectively solve complex detection tasks.
Rich image processing algorithms to meet most detection and measurement tasks.
Product Tags:
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Max. 500mm x 500mm PCB Size 3D AOI Machine for Precise Inspection at 1000mm/s Images
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